玄幻小说排行榜完本,怎样写网络小说 http://domaint.cn/en Fri, 06 Dec 2019 04:00:53 +0000 zh-CN hourly 1 https://wordpress.org/?v=5.3.18 8L Communication board http://domaint.cn/en/multi-layers-pcb/8l-communication-board/ http://domaint.cn/en/multi-layers-pcb/8l-communication-board/#respond Tue, 02 Jul 2019 09:07:34 +0000 http://domaint.cn/en/?p=532
PCB-D-6
  • Brand Name: Customized
  • Min.Order Quantity:?No
  • Supply Ability:?30~50 thousand ㎡/Month
  • Port:?Shenzhen
  • Service:?EMS/OEM/ODM
  • Payment Terms:?T/T,Paypal,WU etc.
  • Layer:?16
  • Base Material:?High Tg FR4
  • Copper Thickness:?1oz
  • Board Thickness:?2.43mm
  • Solder Mask Color:?Green(can customized)
  • Silkscreen Color:?White(can customized)
  • Surface Finishing:?Immersion Gold
  • Application Industry:?Industrial Control
  • Application Products:?Core board
  • Outer Line width/space:?4/4mil
  • Inner Line width/space:?3.5/3.5mil
  • Min.Hole Size:?0.75mm
  • Test Way:?100% E-Test
  • Standard:?IPC-Class2/Class 3

PRODUCT DETAIL

8 layers boards fr4 94v0 rohs pcb for the fingerprint Scanner

Advantages

–?No MOQ

– OEM services provided

–?Heavy copper PCB,?Heavy gold PCB,?Blind / Buried via PCB,?High layer count PCB? manufacturable

– Factory direct price

– Replying with price?in?one working day

– Shipping?within 24 hours

– Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability
Number of Layer 1 – 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
4 Layer – 0.4MM ( 16 mil )
6 Layer – 0.8MM ( 32 mil )
8 Layer – 1.0MM ( 40 mil)
10 Layer – 1.1MM ( 44 mil )
12 Layer – 1.3MM ( 52 mil )
14 Layer – 1.5MM ( 59 mil )
16 Layer – 1.6MM ( 63 mil )
18 Layer – 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 – 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness 1 – 6OZ
Inner Layer Cu Thickness 0.5 – 4OZ
Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with Lead Tin 63% Lead 37%
HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” )
Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )
U940 PCB Pattern Limit Capability
Min Width 0.075MM ( 3 mil )
Min Trace 0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
Min Solder Bridge 0.1MM ( 4 mil )
Min Height of Legend 0.7MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size 0.10 – 6.5MM
Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM
φ1.60 – 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM
φ1.60 – 6.50MM ± 0.05MM
Drilling Strip Hole -0L ~tu.’gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size ≤ 10:1
PCB Cover Thickness Capability
Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness Surface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 – 25UM
Solder Mask Bridge Width
Legend Color White,Yellow,Black
Min Height of Legend 0.70MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
Blue Gel Thickness 0.2 – 1.5MM
Blue Gel Tolerance ±0.15MM
Carbon Print Thickness 5 – 25UM
Carbon Print Min Space 0.25MM
Carbon Print Impedance 200Ω
Blind/Burried/Half Via PCB Capability
Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8
Min Via Laser 0.1MM, Machine 0.2MM
Half Via Min: 0.6MM
Impedance Capability
Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω

]]> http://domaint.cn/en/multi-layers-pcb/8l-communication-board/feed/ 0 10L industrial control board http://domaint.cn/en/multi-layers-pcb/10l-industrial-control-board/ http://domaint.cn/en/multi-layers-pcb/10l-industrial-control-board/#respond Tue, 02 Jul 2019 09:06:10 +0000 http://domaint.cn/en/?p=529
PCB-D-5
  • Brand Name: Customized
  • Min.Order Quantity:?No
  • Supply Ability:?30~50 thousand ㎡/Month
  • Port:?Shenzhen
  • Service:?EMS/OEM/ODM
  • Payment Terms:?T/T,Paypal,WU etc.
  • Layer:?16
  • Base Material:?High Tg FR4
  • Copper Thickness:?1oz
  • Board Thickness:?2.43mm
  • Solder Mask Color:?Green(can customized)
  • Silkscreen Color:?White(can customized)
  • Surface Finishing:?Immersion Gold
  • Application Industry:?Industrial Control
  • Application Products:?Core board
  • Outer Line width/space:?4/4mil
  • Inner Line width/space:?3.5/3.5mil
  • Min.Hole Size:?0.75mm
  • Test Way:?100% E-Test
  • Standard:?IPC-Class2/Class 3

PRODUCT DETAIL

6 layers boards fr4 94v0 rohs pcb for the fingerprint Scanner

Advantages

–?No MOQ

– OEM services provided

–?Heavy copper PCB,?Heavy gold PCB,?Blind / Buried via PCB,?High layer count PCB? manufacturable

– Factory direct price

– Replying with price?in?one working day

– Shipping?within 24 hours

– Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability
Number of Layer 1 – 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
4 Layer – 0.4MM ( 16 mil )
6 Layer – 0.8MM ( 32 mil )
8 Layer – 1.0MM ( 40 mil)
10 Layer – 1.1MM ( 44 mil )
12 Layer – 1.3MM ( 52 mil )
14 Layer – 1.5MM ( 59 mil )
16 Layer – 1.6MM ( 63 mil )
18 Layer – 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 – 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness 1 – 6OZ
Inner Layer Cu Thickness 0.5 – 4OZ
Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with Lead Tin 63% Lead 37%
HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” )
Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )
U940 PCB Pattern Limit Capability
Min Width 0.075MM ( 3 mil )
Min Trace 0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
Min Solder Bridge 0.1MM ( 4 mil )
Min Height of Legend 0.7MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size 0.10 – 6.5MM
Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM
φ1.60 – 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM
φ1.60 – 6.50MM ± 0.05MM
Drilling Strip Hole -0L ~tu.’gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size ≤ 10:1
PCB Cover Thickness Capability
Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness Surface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 – 25UM
Solder Mask Bridge Width
Legend Color White,Yellow,Black
Min Height of Legend 0.70MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
Blue Gel Thickness 0.2 – 1.5MM
Blue Gel Tolerance ±0.15MM
Carbon Print Thickness 5 – 25UM
Carbon Print Min Space 0.25MM
Carbon Print Impedance 200Ω
Blind/Burried/Half Via PCB Capability
Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8
Min Via Laser 0.1MM, Machine 0.2MM
Half Via Min: 0.6MM
Impedance Capability
Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω

]]> http://domaint.cn/en/multi-layers-pcb/10l-industrial-control-board/feed/ 0 6L Mobile phone board http://domaint.cn/en/multi-layers-pcb/6l-mobile-phone-board/ http://domaint.cn/en/multi-layers-pcb/6l-mobile-phone-board/#respond Tue, 02 Jul 2019 09:04:55 +0000 http://domaint.cn/en/?p=527
PCB-D-4
  • Brand Name: Customized
  • Min.Order Quantity:?No
  • Supply Ability:?30~50 thousand ㎡/Month
  • Port:?Shenzhen
  • Service:?EMS/OEM/ODM
  • Payment Terms:?T/T,Paypal,WU etc.
  • Layer:?16
  • Base Material:?High Tg FR4
  • Copper Thickness:?1oz
  • Board Thickness:?2.43mm
  • Solder Mask Color:?Green(can customized)
  • Silkscreen Color:?White(can customized)
  • Surface Finishing:?Immersion Gold
  • Application Industry:?Industrial Control
  • Application Products:?Core board
  • Outer Line width/space:?4/4mil
  • Inner Line width/space:?3.5/3.5mil
  • Min.Hole Size:?0.75mm
  • Test Way:?100% E-Test
  • Standard:?IPC-Class2/Class 3

PRODUCT DETAIL

6 layers boards fr4 94v0 rohs pcb for the fingerprint Scanner

Advantages

–?No MOQ

– OEM services provided

–?Heavy copper PCB,?Heavy gold PCB,?Blind / Buried via PCB,?High layer count PCB? manufacturable

– Factory direct price

– Replying with price?in?one working day

– Shipping?within 24 hours

– Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity
PCB General Capability
Number of Layer 1 – 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
4 Layer – 0.4MM ( 16 mil )
6 Layer – 0.8MM ( 32 mil )
8 Layer – 1.0MM ( 40 mil)
10 Layer – 1.1MM ( 44 mil )
12 Layer – 1.3MM ( 52 mil )
14 Layer – 1.5MM ( 59 mil )
16 Layer – 1.6MM ( 63 mil )
18 Layer – 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 – 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness 1 – 6OZ
Inner Layer Cu Thickness 0.5 – 4OZ
Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with Lead Tin 63% Lead 37%
HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” )
Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )
U940 PCB Pattern Limit Capability
Min Width 0.075MM ( 3 mil )
Min Trace 0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
Min Solder Bridge 0.1MM ( 4 mil )
Min Height of Legend 0.7MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size 0.10 – 6.5MM
Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM
φ1.60 – 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM
φ1.60 – 6.50MM ± 0.05MM
Drilling Strip Hole -0L ~tu.’gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size ≤ 10:1
PCB Cover Thickness Capability
Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness Surface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 – 25UM
Solder Mask Bridge Width
Legend Color White,Yellow,Black
Min Height of Legend 0.70MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
Blue Gel Thickness 0.2 – 1.5MM
Blue Gel Tolerance ±0.15MM
Carbon Print Thickness 5 – 25UM
Carbon Print Min Space 0.25MM
Carbon Print Impedance 200Ω
Blind/Burried/Half Via PCB Capability
Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8
Min Via Laser 0.1MM, Machine 0.2MM
Half Via Min: 0.6MM
Impedance Capability
Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω

]]> http://domaint.cn/en/multi-layers-pcb/6l-mobile-phone-board/feed/ 0 6L HDI http://domaint.cn/en/multi-layers-pcb/6l-hdi/ http://domaint.cn/en/multi-layers-pcb/6l-hdi/#respond Tue, 02 Jul 2019 09:03:35 +0000 http://domaint.cn/en/?p=525
PCB-D-3
  • Brand Name: Customized
  • Min.Order Quantity:?No
  • Supply Ability:?30~50 thousand ㎡/Month
  • Port:?Shenzhen
  • Service:?EMS/OEM/ODM
  • Payment Terms:?T/T,Paypal,WU etc.
  • Layer:?16
  • Base Material:?High Tg FR4
  • Copper Thickness:?1oz
  • Board Thickness:?2.43mm
  • Solder Mask Color:?Green(can customized)
  • Silkscreen Color:?White(can customized)
  • Surface Finishing:?Immersion Gold
  • Application Industry:?Industrial Control
  • Application Products:?Core board
  • Outer Line width/space:?4/4mil
  • Inner Line width/space:?3.5/3.5mil
  • Min.Hole Size:?0.75mm
  • Test Way:?100% E-Test
  • Standard:?IPC-Class2/Class 3

PRODUCT DETAIL

Our Production Capability for PCB:

Layer 1-28
Board finished thickness 0.21mm-7.0mm
Material FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers
Max. finished board size 23 × 25? ( 580mm×900mm )
Min. drilled hole size 3mil (0.075mm)
Min. Line width 3mil (0.075mm)
Min.Line spacing 3mil (0.075mm)
Surface finish/treatment HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating
Copper thickness 0.5-7.0 OZ
Solder mask color green/yellow/black/white/red/blue
Copper thickness in hole >25.0 um? (>1mil)
Inner packing Vacuum packing / Plastic bag
Outer packing Standard carton packing
Shape tolerance ±0.13
Hole tolerance PTH: ±0.076?? NPTH: ±0.05
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling
Certificate ROHS, UL, ISO9001-2000, ISO14001
E-Testing 100% E-Testing (High Voltage Testing);? Flying Probe Testing
Date file format GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++

]]> http://domaint.cn/en/multi-layers-pcb/6l-hdi/feed/ 0 Multi-Layers PCB http://domaint.cn/en/multi-layers-pcb/multi-layers-pcb/ http://domaint.cn/en/multi-layers-pcb/multi-layers-pcb/#respond Tue, 02 Jul 2019 09:02:28 +0000 http://domaint.cn/en/?p=523
PCB-D-2
  • Brand Name: Customized
  • Min.Order Quantity:?No
  • Supply Ability:?30~50 thousand ㎡/Month
  • Port:?Shenzhen
  • Service:?EMS/OEM/ODM
  • Payment Terms:?T/T,Paypal,WU etc.
  • Layer:?16
  • Base Material:?High Tg FR4
  • Copper Thickness:?1oz
  • Board Thickness:?2.43mm
  • Solder Mask Color:?Green(can customized)
  • Silkscreen Color:?White(can customized)
  • Surface Finishing:?Immersion Gold
  • Application Industry:?Industrial Control
  • Application Products:?Core board
  • Outer Line width/space:?4/4mil
  • Inner Line width/space:?3.5/3.5mil
  • Min.Hole Size:?0.75mm
  • Test Way:?100% E-Test
  • Standard:?IPC-Class2/Class 3

PRODUCT DETAIL

–?No MOQ

– OEM services provided

–?Heavy copper PCB,?Heavy gold PCB,?Blind / Buried via PCB,?High layer count PCB? manufacturable

– Factory direct price

– Replying with price?in?one working day

– Shipping?within 24 hours

– Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability
Number of Layer 1 – 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
4 Layer – 0.4MM ( 16 mil )
6 Layer – 0.8MM ( 32 mil )
8 Layer – 1.0MM ( 40 mil)
10 Layer – 1.1MM ( 44 mil )
12 Layer – 1.3MM ( 52 mil )
14 Layer – 1.5MM ( 59 mil )
16 Layer – 1.6MM ( 63 mil )
18 Layer – 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 – 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness 1 – 6OZ
Inner Layer Cu Thickness 0.5 – 4OZ
Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with Lead Tin 63% Lead 37%
HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” )
Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )
U940 PCB Pattern Limit Capability
Min Width 0.075MM ( 3 mil )
Min Trace 0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
Min Solder Bridge 0.1MM ( 4 mil )
Min Height of Legend 0.7MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size 0.10 – 6.5MM
Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM
φ1.60 – 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM
φ1.60 – 6.50MM ± 0.05MM
Drilling Strip Hole -0L ~tu.’gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size ≤ 10:1
PCB Cover Thickness Capability
Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness Surface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 – 25UM
Solder Mask Bridge Width
Legend Color White,Yellow,Black
Min Height of Legend 0.70MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
Blue Gel Thickness 0.2 – 1.5MM
Blue Gel Tolerance ±0.15MM
Carbon Print Thickness 5 – 25UM
Carbon Print Min Space 0.25MM
Carbon Print Impedance 200Ω
Blind/Burried/Half Via PCB Capability
Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8
Min Via Laser 0.1MM, Machine 0.2MM
Half Via Min: 0.6MM
Impedance Capability
Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω

]]> http://domaint.cn/en/multi-layers-pcb/multi-layers-pcb/feed/ 0 4 Layers PCB http://domaint.cn/en/multi-layers-pcb/4-layers-pcb-2/ http://domaint.cn/en/multi-layers-pcb/4-layers-pcb-2/#respond Tue, 02 Jul 2019 09:00:42 +0000 http://domaint.cn/en/?p=515
PCB-D-1
  • Brand Name: Customized
  • Min.Order Quantity:?No
  • Supply Ability:?30~50 thousand ㎡/Month
  • Port:?Shenzhen
  • Service:?EMS/OEM/ODM
  • Payment Terms:?T/T,Paypal,WU etc.
  • Layer:?16
  • Base Material:?High Tg FR4
  • Copper Thickness:?1oz
  • Board Thickness:?2.43mm
  • Solder Mask Color:?Green(can customized)
  • Silkscreen Color:?White(can customized)
  • Surface Finishing:?Immersion Gold
  • Application Industry:?Industrial Control
  • Application Products:?Core board
  • Outer Line width/space:?4/4mil
  • Inner Line width/space:?3.5/3.5mil
  • Min.Hole Size:?0.75mm
  • Test Way:?100% E-Test
  • Standard:?IPC-Class2/Class 3

PRODUCT DETAIL

8 layers boards fr4 94v0 rohs pcb for the fingerprint Scanner

Advantages

–?No MOQ

– OEM services provided

–?Heavy copper PCB,?Heavy gold PCB,?Blind / Buried via PCB,?High layer count PCB? manufacturable

– Factory direct price

– Replying with price?in?one working day

– Shipping?within 24 hours

– Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability
Number of Layer 1 – 20 Layer
Maximum Processing Area 680 × 1000MM
Min Board Thickness 2 Layer – 0.3MM ( 12 mil )
4 Layer – 0.4MM ( 16 mil )
6 Layer – 0.8MM ( 32 mil )
8 Layer – 1.0MM ( 40 mil)
10 Layer – 1.1MM ( 44 mil )
12 Layer – 1.3MM ( 52 mil )
14 Layer – 1.5MM ( 59 mil )
16 Layer – 1.6MM ( 63 mil )
18 Layer – 1.8MM ( 71 mil )
Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending ≤ 0.75%, Min: 0.5%
Range of TG 130 – 215 ℃
Impedance Tolerance ± 10%, Min: ± 5%
Hi-Pot Test Max: 4000V/10MA/60S
Surface Treatment HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP
PCB Cu Thickness + Plating
Out Layer Cu Thickness 1 – 6OZ
Inner Layer Cu Thickness 0.5 – 4OZ
Cu Thickness of PTH 20UM ≤ Average ≤ 25UM
Min: 18UM
HASL with Lead Tin 63% Lead 37%
HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” )
Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” )
Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” )
Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” )
Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” )
Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” )
U940 PCB Pattern Limit Capability
Min Width 0.075MM ( 3 mil )
Min Trace 0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil )
Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil )
Min Solder Bridge 0.1MM ( 4 mil )
Min Height of Legend 0.7MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
PCB Holes Processing Capability
Final Hole Size Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size 0.10 – 6.5MM
Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM
φ1.60 – 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM
φ1.60 – 6.50MM ± 0.05MM
Drilling Strip Hole -0L ~tu.’gth /width 2:1
Min Strip Hole Width 0.65MM
Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size ≤ 10:1
PCB Cover Thickness Capability
Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness Surface Line ≥ 10UM
Surface Line Corner ≥ 6UM
Surface Board 10 – 25UM
Solder Mask Bridge Width
Legend Color White,Yellow,Black
Min Height of Legend 0.70MM ( 28 mil )
Min Width of Legend 0.15MM ( 6 mil )
Blue Gel Thickness 0.2 – 1.5MM
Blue Gel Tolerance ±0.15MM
Carbon Print Thickness 5 – 25UM
Carbon Print Min Space 0.25MM
Carbon Print Impedance 200Ω
Blind/Burried/Half Via PCB Capability
Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8
Min Via Laser 0.1MM, Machine 0.2MM
Half Via Min: 0.6MM
Impedance Capability
Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω

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